A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Achieving high reliability and low cost package substrate compared with silicon interposer package Tokyo, December 11, 2015 --- Hitachi, Ltd. (TSE: 6501) and Hitachi Metals, Ltd. (TSE: 5486) have ...
(Nanowerk News) In recent times, humans have faced the threats of global warming and depletion of energy resources. In Japan, about 40% of the greenhouse gases generated due to energy consumption are ...
Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results