As AI workloads scale, data center infrastructure faces mounting pressure from power demand, grid constraints and cooling limits.

The thermal management of high-density computing environments represents one of the most consequential engineering challenges of the contemporary era, requiring specialized expertise that extends far beyond conventional HVAC principles.

Carbice’s solution, known as the Ice Pad, solves this problem both on a thermal and a mechanical level, Cola says. By laying a sheet of nanotubes across the chip, where the paste would be, he says it is much easier to achieve predictable cooling performance, leading to a more efficient and cost-effective system.

Data centers require substantial water and energy. But certain locations are more strained than others, mainly due to rising temperatures.

2025 revealed how data center outages, from fires and mechanical failures to hyperscale cloud region events, can cascade quickly in an AI-driven world, highlighting the growing importance of physical resilience, control-plane reliability, and clean recovery.

Investors are shifting focus from chip makers like Nvidia to infrastructure 'pick-and-shovel' companies supplying power, cooling and construction services.

Onstream OS spiked nearly 23% in huge volume on news it is in advanced talks to be acquired by HG Capital. The stock reclaimed its 200-day moving average but has underperformed, as seen in its weak Relative Strength Rating of 16 from Investor's Business Daily.