Abstract: We present a new approach to the problem of detecting element failures in any kind of array antenna. The proposed method requires only phaseless information on the generated field and ...
Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback